Wirebonding in Microelectronics (Set 2) - Harman - Books - McGraw-Hill Education - Europe - 9780071701013 - February 1, 2010
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Harman
Wirebonding in Microelectronics (Set 2) 3 Rev edition

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Wire bonding is the attachment of fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. This title covers wire bonding advances for the era of super-small electronics.

Media Books     Book
Released February 1, 2010
ISBN13 9780071701013
Publishers McGraw-Hill Education - Europe
Dimensions 150 × 220 × 20 mm   ·   500 g   (Weight (estimated))

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