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Area Array Packaging Materials
Ken Gilleo
Area Array Packaging Materials
Ken Gilleo
This engineering reference covers the most important assembly processes in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Processes includes vital information necessary for the manufacture of cutting-edge electronics products.
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | October 24, 2003 |
ISBN13 | 9780071738002 |
Publishers | McGraw-Hill |
Pages | 176 |
Dimensions | 231 × 9 × 188 mm · 312 g |
Language | English |