3D IC Integration and Packaging - John Lau - Books - McGraw-Hill Education - Europe - 9780071848060 - October 16, 2015
In case cover and title do not match, the title is correct

3D IC Integration and Packaging Ed edition

Price
Íkr 30,219
excl. VAT

Ordered from remote warehouse

Expected delivery Aug 27 - Sep 10
Get notified about new John Lau releases
Add to your iMusic wish list

Not rated yet

A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications


512 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 16, 2015
ISBN13 9780071848060
Publishers McGraw-Hill Education - Europe
Pages 480
Dimensions 196 × 245 × 28 mm   ·   1.03 kg
Language English  

More by John Lau

Show all

More from the same publisher