Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability - Woodhead Publishing Series in Electronic and Optical Materials - Katsuaki Suganuma - Books - Elsevier Science & Technology - 9780081020944 - May 30, 2018
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Katsuaki Suganuma
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability - Woodhead Publishing Series in Electronic and Optical Materials

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240 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 30, 2018
ISBN13 9780081020944
Publishers Elsevier Science & Technology
Pages 240
Dimensions 228 × 155 × 13 mm   ·   326 g
Editor Suganuma, Katsuaki (The Institute of Scientific and Industrial Research, Osaka University, Japan)

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