Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications - Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) - Books - William Andrew Publishing - 9780128119785 - October 11, 2018
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Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)
Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2nd edition

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498 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 11, 2018
ISBN13 9780128119785
Publishers William Andrew Publishing
Pages 508
Dimensions 151 × 229 × 24 mm   ·   675 g
Language English  
Series Editor Licari, James J. (AvanTeco, Whittier, CA, USA)

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