Stress and Strain Engineering at Nanoscale in Semiconductor Devices - Maiti, Chinmay K. (SOA University Bhubaneswar, Odisha, India) - Books - Taylor & Francis Ltd - 9780367519339 - September 25, 2023
In case cover and title do not match, the title is correct

Maiti, Chinmay K. (SOA University Bhubaneswar, Odisha, India)
Stress and Strain Engineering at Nanoscale in Semiconductor Devices

Price
Íkr 11,639
excl. VAT

Ordered from remote warehouse

Expected delivery Aug 19 - Sep 2
Get notified about new Maiti, Chinmay K. (SOA University Bhubaneswar, Odisha, India) releases

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Not rated yet

Also available as:

Based on 3D process and device simulations with mechanical stress simulations by finite element techniques, this book explains performance assessment of nanoscale devices with strained SiGe and other stressors. It explains the process-induced stress transfer and developments at 7nm technology and below node in the area of strain-engineered devices.

260 pages, 23 Tables, black and white; 136 Line drawings, black and white; 3 Halftones, black and wh

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 25, 2023
ISBN13 9780367519339
Publishers Taylor & Francis Ltd
Pages 260
Dimensions 150 × 220 × 10 mm   ·   220 g
Language English  

More from the same publisher

See all of Maiti, Chinmay K. (SOA University Bhubaneswar, Odisha, India) ( e.g. Hardcover Book and Paperback Book )