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Through Silicon Vias: Materials, Models, Design, and Performance 1st edition
Brajesh Kumar Kaushik
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Through Silicon Vias: Materials, Models, Design, and Performance 1st edition
Brajesh Kumar Kaushik
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
216 pages
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | June 30, 2020 |
| ISBN13 | 9780367574543 |
| Publishers | Taylor & Francis Ltd |
| Pages | 216 |
| Dimensions | 453 g |
| Language | English |
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