Integrated Circuit Failure Analysis: A Guide to Preparation Techniques - Quality and Reliability Engineering Series - Beck, Friedrich (Siemens AG, Munich, Germany) - Books - John Wiley & Sons Inc - 9780471974017 - January 19, 1998
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Integrated Circuit Failure Analysis: A Guide to Preparation Techniques - Quality and Reliability Engineering Series

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The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right.


190 pages, index

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 19, 1998
ISBN13 9780471974017
Publishers John Wiley & Sons Inc
Pages 192
Dimensions 237 × 159 × 16 mm   ·   396 g
Language English  

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