Benefiting from Thermal and Mechanical Simulation in Micro-electronics - O De Saint Leger - Books - Kluwer Academic Publishers - 9780792372783 - December 31, 2000
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O De Saint Leger
Benefiting from Thermal and Mechanical Simulation in Micro-electronics

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Presents papers from the international conference on this topic, EuroSimE2000. This book discusses thermal and mechanical related problems and challenges in micro-electronics. It is useful for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

192 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 31, 2000
ISBN13 9780792372783
Publishers Kluwer Academic Publishers
Pages 192
Dimensions 155 × 235 × 12 mm   ·   498 g
Language English  
Editor Ernst, L.j.
Editor Leger, O.de Saint
Editor Zhang, G.q

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