Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development - Way Kuo - Books - Kluwer Academic Publishers - 9780792381075 - January 31, 1998
In case cover and title do not match, the title is correct

Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development 1998 edition

Price
Íkr 19,579
excl. VAT

Ordered from remote warehouse

Expected delivery Jun 17 - 25
Add to your iMusic wish list

Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.


420 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 31, 1998
ISBN13 9780792381075
Publishers Kluwer Academic Publishers
Pages 420
Dimensions 156 × 234 × 23 mm   ·   734 g
Language English  

Mere med samme udgiver