Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing - Fred W. Kear - Books - Taylor & Francis Inc - 9780824784669 - December 16, 1992
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Fred W. Kear
Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing 1st edition

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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

296 pages, 1, black & white illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 16, 1992
ISBN13 9780824784669
Publishers Taylor & Francis Inc
Pages 296
Dimensions 156 × 234 × 17 mm   ·   635 g
Language English  

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