Spice Based Heat Transport Model for Non-intrusive Thermal Diagnostic Applications - Michael A. Stelzer - Books - BookSurge Publishing - 9781419606137 - August 17, 2005
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Michael A. Stelzer
Spice Based Heat Transport Model for Non-intrusive Thermal Diagnostic Applications

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This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released August 17, 2005
ISBN13 9781419606137
Publishers BookSurge Publishing
Pages 160
Dimensions 181 × 8 × 250 mm   ·   290 g
Language English  

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