Advances in CMP Polishing Technologies - Toshiro Doi - Books - William Andrew Publishing - 9781437778595 - December 6, 2011
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Toshiro Doi
Advances in CMP Polishing Technologies

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.

330 pages, 1, black & white illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 6, 2011
ISBN13 9781437778595
Publishers William Andrew Publishing
Pages 328
Dimensions 160 × 239 × 23 mm   ·   544 g
Language English  
Editor Doi, Toshiro (Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan)
Editor Kurokawa, Syuhei
Editor Marinescu, Ioan D. (Professor and Director, Precision Micromachining Center, The University of Toledo, Toledo, OH, USA)

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