Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science - Erdogan Madenci - Books - Springer-Verlag New York Inc. - 9781461349891 - October 14, 2012
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Softcover Reprint of the Original 1st Ed. 2003 edition

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185 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 14, 2012
ISBN13 9781461349891
Publishers Springer-Verlag New York Inc.
Pages 185
Dimensions 156 × 234 × 11 mm   ·   299 g
Language English  

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