Tell your friends about this item:
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages Gerard Kelly Softcover Reprint of the Original 1st Ed. 1999 edition
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages
Gerard Kelly
153 pages, black & white illustrations, bibliography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | October 8, 2012 |
| ISBN13 | 9781461372769 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 134 |
| Dimensions | 155 × 235 × 9 mm · 235 g |
| Language | English |
More by Gerard Kelly
Show allMore from the same publisher
See all of Gerard Kelly ( e.g. Paperback Book and Hardcover Book )