Three-dimensional Integration and Modeling: a Revolution in Rf and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics) - Jong-hoon Lee - Books - Morgan and Claypool Publishers - 9781598292442 - November 1, 2007
In case cover and title do not match, the title is correct

Jong-hoon Lee
Three-dimensional Integration and Modeling: a Revolution in Rf and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics) 1st edition

Get an email once the item is available
Do you have a profile? Log in

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends. Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 1, 2007
ISBN13 9781598292442
Publishers Morgan and Claypool Publishers
Pages 108
Dimensions 191 × 235 × 6 mm   ·   213 g
Language English  

More by Jong-hoon Lee

Show all

See all of Jong-hoon Lee ( e.g. Paperback Book )