System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation - Lei He - Books - now publishers Inc - 9781601984586 - June 30, 2011
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Lei He
System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation

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Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.

94 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 30, 2011
ISBN13 9781601984586
Publishers now publishers Inc
Pages 94
Dimensions 156 × 234 × 5 mm   ·   145 g
Language English  

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