Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing - Seonho Seok - Books - Springer Nature Switzerland AG - 9783030085612 - January 5, 2019
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Seonho Seok
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Softcover Reprint of the Original 1st 2018 edition

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Media Books     Paperback Book   (Book with soft cover and glued back)
Released January 5, 2019
ISBN13 9783030085612
Publishers Springer Nature Switzerland AG
Pages 115
Dimensions 150 × 220 × 10 mm   ·   185 g
Language German  

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