Materials for Advanced Packaging - - Books - Springer International Publishing AG - 9783319450971 - December 30, 2016
In case cover and title do not match, the title is correct

Materials for Advanced Packaging 2nd ed. 2017 edition

Price
Íkr 37,819
excl. VAT

Ordered from remote warehouse

Expected delivery Jul 22 - 30

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Not rated yet

Also available as:

Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.

983 pages, 260 black & white illustrations, 440 colour illustrations, 85 black & white tables, 434 c

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 30, 2016
ISBN13 9783319450971
Publishers Springer International Publishing AG
Pages 969
Dimensions 155 × 235 × 51 mm   ·   1.55 kg
Language French  
Editor Lu, Daniel
Editor Wong, C.P.

More from the same publisher