Testing of Interposer-Based 2.5D Integrated Circuits - Ran Wang - Books - Springer International Publishing AG - 9783319547138 - March 29, 2017
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Ran Wang
Testing of Interposer-Based 2.5D Integrated Circuits 1st ed. 2017 edition

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The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p

Media Books     Hardcover Book   (Book with hard spine and cover)
Released March 29, 2017
ISBN13 9783319547138
Publishers Springer International Publishing AG
Pages 182
Dimensions 150 × 220 × 20 mm   ·   453 g
Language German  

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