Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering - Cheng - Books - Springer Verlag, Singapore - 9789811501722 - December 16, 2019
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Cheng
Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering 2020 edition

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Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application.

685 pages, 110 Tables, color; 232 Illustrations, color; 391 Illustrations, black and white; XXX, 685

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 16, 2019
ISBN13 9789811501722
Publishers Springer Verlag, Singapore
Pages 685
Dimensions 164 × 245 × 43 mm   ·   1.24 kg
Editor Cheng, Zhiguang
Editor Forghani, Behzad
Editor Takahashi, Norio

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