Chiplet Design and Heterogeneous Integration Packaging - John H. Lau - Books - Springer Verlag, Singapore - 9789811999192 - March 29, 2024
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Chiplet Design and Heterogeneous Integration Packaging 2023 edition

John H. Lau

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Chiplet Design and Heterogeneous Integration Packaging 2023 edition

525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 29, 2024
ISBN13 9789811999192
Publishers Springer Verlag, Singapore
Pages 525
Dimensions 920 g

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