Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology - Cher Ming Tan - Books - Springer Verlag, Singapore - 9789814451208 - May 4, 2013
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Cher Ming Tan
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition

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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.

120 pages, 73 black & white illustrations, 2 colour illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 4, 2013
ISBN13 9789814451208
Publishers Springer Verlag, Singapore
Pages 103
Dimensions 155 × 235 × 6 mm   ·   1.88 kg

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