Microelectronics Packaging Handbook: Subsystem Packaging Part III - R.R. Tummala - Books - Chapman and Hall - 9780412084515 - January 31, 1997
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R.R. Tummala
Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition

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Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.

657 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 31, 1997
ISBN13 9780412084515
Publishers Chapman and Hall
Pages 628
Dimensions 155 × 235 × 36 mm   ·   993 g
Language English   French  

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