Tell your friends about this item:
Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition
R.R. Tummala
Price
zł 684.90
excl. VAT
Ordered from remote warehouse
Expected delivery Jul 11 - 22
Our customers say:
Add to your iMusic wish list
Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition
R.R. Tummala
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.
657 pages, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | January 31, 1997 |
| ISBN13 | 9780412084515 |
| Publishers | Chapman and Hall |
| Pages | 628 |
| Dimensions | 155 × 235 × 36 mm · 993 g |
| Language | English French |
Show all
More by R.R. Tummala
![Cover for R.R. Tummala · Microelectronics Packaging Handbook: Technology Drivers Part I (Paperback Book) [Softcover reprint of the original 2nd ed. 1997 edition] (2012)](https://imusic.b-cdn.net/images/item/original/298/9781461368298.jpg?r-r-tummala-2012-microelectronics-packaging-handbook-technology-drivers-part-i-paperback-book&class=scaled&v=1604039171)
![Cover for R.R. Tummala · Microelectronics Packaging Handbook: Technology Drivers Part I (Hardcover Book) [2nd ed. 1997 edition] (1997)](https://imusic.b-cdn.net/images/item/original/317/9780412084317.jpg?r-r-tummala-1997-microelectronics-packaging-handbook-technology-drivers-part-i-hardcover-book&class=scaled&v=1498576498)
![Cover for R.R. Tummala · Microelectronics Packaging Handbook: Semiconductor Packaging (Hardcover Book) [2nd ed. 1997 edition] (1997)](https://imusic.b-cdn.net/images/item/original/416/9780412084416.jpg?r-r-tummala-1997-microelectronics-packaging-handbook-semiconductor-packaging-hardcover-book&class=scaled&v=1408891060)
See all of R.R. Tummala ( e.g. Hardcover Book , Paperback Book and Book )