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Microelectronics Packaging Handbook: Technology Drivers Part I Softcover reprint of the original 2nd ed. 1997 edition
R.R. Tummala
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Microelectronics Packaging Handbook: Technology Drivers Part I Softcover reprint of the original 2nd ed. 1997 edition
R.R. Tummala
Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
720 pages, biography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | October 23, 2012 |
| Original release date | 1997 |
| ISBN13 | 9781461368298 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 720 |
| Dimensions | 155 × 235 × 38 mm · 1.03 kg |
| Language | English |
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