Microelectronics Packaging Handbook: Technology Drivers Part I - R.R. Tummala - Books - Springer-Verlag New York Inc. - 9781461368298 - October 23, 2012
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R.R. Tummala
Microelectronics Packaging Handbook: Technology Drivers Part I Softcover reprint of the original 2nd ed. 1997 edition

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Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

720 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 23, 2012
Original release date 1997
ISBN13 9781461368298
Publishers Springer-Verlag New York Inc.
Pages 720
Dimensions 155 × 235 × 38 mm   ·   1.03 kg
Language English  

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