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Tin and Solder Plating in the Semiconductor Industry 1993 edition
A.C. Tan
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Tin and Solder Plating in the Semiconductor Industry 1993 edition
A.C. Tan
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
352 pages, black & white illustrations
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | November 30, 1992 |
| ISBN13 | 9780412482403 |
| Publishers | Chapman and Hall |
| Pages | 326 |
| Dimensions | 210 × 297 × 20 mm · 666 g |
| Language | English |
See all of A.C. Tan ( e.g. Hardcover Book )