Tell your friends about this item:
Manufacturing Challenges in Electronic Packaging Lee 1998 edition
Manufacturing Challenges in Electronic Packaging
Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | December 31, 1997 |
| ISBN13 | 9780412620300 |
| Publishers | Chapman and Hall |
| Pages | 261 |
| Dimensions | 155 × 235 × 17 mm · 562 g |
| Language | English |
| Editor | Chen, W.T. |
| Editor | Lee, Y.C. |
More by Lee
Show allMere med samme udgiver
See all of Lee ( e.g. Book , Paperback Book , Hardcover Book , CD and DVD )