Benefiting from Thermal and Mechanical Simulation in Micro-electronics - G Q Zhang - Books - Springer-Verlag New York Inc. - 9781441948731 - December 3, 2010
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G Q Zhang
Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition

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192 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 3, 2010
ISBN13 9781441948731
Publishers Springer-Verlag New York Inc.
Pages 192
Dimensions 156 × 234 × 11 mm   ·   299 g
Language English  
Editor Ernst, L.j.
Editor Leger, O.de Saint
Editor Zhang, G.q

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