Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development - Way Kuo - Books - Springer-Verlag New York Inc. - 9781461375968 - March 14, 2014
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Way Kuo
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Softcover Reprint of the Original 1st Ed. 1998 edition

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420 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 14, 2014
ISBN13 9781461375968
Publishers Springer-Verlag New York Inc.
Pages 420
Dimensions 155 × 235 × 22 mm   ·   589 g
Language English  

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