RF and Microwave Microelectronics Packaging - Ken Kuang - Books - Springer-Verlag New York Inc. - 9781489983244 - September 5, 2014
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Ken Kuang
RF and Microwave Microelectronics Packaging 2010 edition

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.

285 pages, 15 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 5, 2014
ISBN13 9781489983244
Publishers Springer-Verlag New York Inc.
Pages 285
Dimensions 155 × 235 × 16 mm   ·   426 g
Language English  
Editor Cahill, Sean S.
Editor Kim, Franklin
Editor Kuang, Ken

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