Design for High Performance, Low Power, and Reliable 3D Integrated Circuits - Sung Kyu Lim - Books - Springer-Verlag New York Inc. - 9781489986962 - December 16, 2014
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Sung Kyu Lim
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits 2013 edition

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This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.

560 pages, 167 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 16, 2014
Original release date 2012
ISBN13 9781489986962
Publishers Springer-Verlag New York Inc.
Pages 560
Dimensions 155 × 235 × 30 mm   ·   816 g
Language English  

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