Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing - Seonho Seok - Books - Springer International Publishing AG - 9783319778716 - May 14, 2018
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Seonho Seok
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing 2018 edition

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115 pages, 106 Illustrations, black and white; VIII, 115 p. 106 illus.

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 14, 2018
ISBN13 9783319778716
Publishers Springer International Publishing AG
Pages 115
Dimensions 150 × 220 × 20 mm   ·   353 g

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