This large international conference covered advances in engineering technologies and the physical sciences, with contributions on subjects including mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications.

556 pages, 250 black & white illustrations, 10 colour tables, biography

Media	Books Hardcover Book (Book with hard spine and cover)
Released	June 24, 2016
ISBN13	9789811010873
Publishers	Springer Verlag, Singapore
Pages	546
Dimensions	1.09 kg
Editor	Ao, Sio-Iong
Editor	Gelman, Len
Editor	Yang, Gi-Chul