This large international conference covered advances in engineering technologies and the physical sciences, with contributions on subjects including mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications.

546 pages, 10 Tables, color; 250 Illustrations, black and white; X, 546 p. 250 illus.

Media	Books Paperback Book (Book with soft cover and glued back)
Released	June 7, 2018
ISBN13	9789811093265
Publishers	Springer Verlag, Singapore
Pages	546
Dimensions	933 g
Editor	Ao, Sio-Iong
Editor	Gelman, Len
Editor	Yang, Gi-Chul