Heterogeneous Integrations - John H. Lau - Books - Springer Verlag, Singapore - 9789811372230 - April 12, 2019
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John H. Lau
Heterogeneous Integrations 2019 edition

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This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.

368 pages, 300 Tables, color; 342 Illustrations, color; 44 Illustrations, black and white; XXII, 368

Media Books     Hardcover Book   (Book with hard spine and cover)
Released April 12, 2019
ISBN13 9789811372230
Publishers Springer Verlag, Singapore
Pages 368
Dimensions 150 × 220 × 20 mm   ·   752 g

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