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Semiconductor Advanced Packaging 1st ed. 2021 edition
John H. Lau
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Semiconductor Advanced Packaging 1st ed. 2021 edition
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | May 18, 2021 |
| ISBN13 | 9789811613753 |
| Publishers | Springer Verlag, Singapore |
| Pages | 498 |
| Dimensions | 163 × 242 × 41 mm · 939 g |
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