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All 14 John H. Lau releases on Book, Paperback Book ... Book
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Releases by
John H. Lau
Hardcover Book
Flip Chip, Hybrid Bonding, Fan-I...
(2024)
John H. Lau
Íkr 21,389
Buy
Paperback Book
2023 edition
Chiplet Design and Heterogeneous...
(2024)
John H. Lau
Íkr 16,479
Buy
Hardcover Book
2023 edition
Chiplet Design and Heterogeneous...
(2023)
John H. Lau
Íkr 22,609
Buy
Paperback Book
1st ed. 2021 edition
Semiconductor Advanced Packaging
(2022)
John H. Lau
Íkr 14,019
Buy
Paperback Book
2020 edition
Assembly and Reliability of Lead...
(2021)
John H. Lau
Íkr 14,629
Buy
Hardcover Book
1st ed. 2021 edition
Semiconductor Advanced Packaging
(2021)
John H. Lau
Íkr 20,149
Buy
Hardcover Book
2020 edition
Assembly and Reliability of Lead...
(2020)
John H. Lau
Íkr 20,149
Buy
Hardcover Book
2019 edition
Heterogeneous Integrations
(2019)
John H. Lau
Íkr 20,149
Buy
Paperback Book
Softcover reprint of the original 1st ed. 2018 edition
Fan-Out Wafer-Level Packaging
(2018)
John H. Lau
Íkr 14,019
Buy
Book
1st ed. 2018 edition
Fan Out Wafer Level Packaging
(2018)
John H. Lau
Íkr 18,929
Buy
Paperback Book
Softcover reprint of the original 1st ed. 1991 edition
Solder Joint Reliability: Theory...
(2014)
John H. Lau
Íkr 25,719
Buy
Hardcover Book
1994 edition
Chip on Board: Technology for Mu...
(1994)
John H. Lau
Íkr 29,449
Buy
Hardcover Book
1992 edition
Handbook Of Tape Automated Bonding
(1992)
John H. Lau
Íkr 25,719
Buy
Hardcover Book
1991 edition
Solder Joint Reliability: Theory...
(1991)
John H. Lau
Íkr 29,449
Buy
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Paperback Book) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/192/9789811999192.jpg?john-h-lau-2024-chiplet-design-and-heterogeneous-integration-packaging-paperback-book&class=scaled&v=1722057566)
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Hardcover Book) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-hardcover-book&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Paperback Book) [1st ed. 2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-paperback-book&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Paperback Book) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-paperback-book&class=scaled&v=1622167029)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Hardcover Book) [1st ed. 2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-hardcover-book&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-hardcover-book&class=scaled&v=1588376991)
![Cover for John H. Lau · Heterogeneous Integrations (Hardcover Book) [2019 edition] (2019)](https://imusic.b-cdn.net/images/item/original/230/9789811372230.jpg?john-h-lau-2019-heterogeneous-integrations-hardcover-book&class=scaled&v=1588376885)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Paperback Book) [Softcover reprint of the original 1st ed. 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/660/9789811342660.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-paperback-book&class=scaled&v=1588376983)
![Cover for John H. Lau · Fan Out Wafer Level Packaging (Book) [1st ed. 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/834/9789811088834.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-book&class=scaled&v=1588376972)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Paperback Book) [Softcover reprint of the original 1st ed. 1991 edition] (2014)](https://imusic.b-cdn.net/images/item/original/437/9781461367437.jpg?john-h-lau-2014-solder-joint-reliability-theory-and-applications-paperback-book&class=scaled&v=1516985150)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Hardcover Book) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-hardcover-book&class=scaled&v=1570666783)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-hardcover-book&class=scaled&v=1516985150)